Model

– HBJC153I23-Q670B (Default)
– HBJC153I23-Q670G4 (Expansion PCIe 4* Lan Card) system total up to 12* LAN ports
– HBJC153I23-Q670B4 (Expansion PCIe 4* Bypass Lan Card) system total up to 12* LAN ports

MB Model

– MI23-Q6700 (Q670E)
– MI23-Q6702 (optional , Q670E,onboard TPM2.0)

CPU/Chipset

– Intel® 12th/13th LGA1700 Socket Core i7/i5/i3/Pentium/Celeron Processor(Max. 65W TDPs under 180A)
– Intel® Q670E Chipset

BIOS

– AMI Flash ROM
– Support recover crashed BIOS data tool by a USB flash pen driver: Using JetBIOS SW back up tool with any external USB ports

Memory

– 2* DDR5 4800MHz SO-DIMM up to 64GB

Network

– 7* Intel® i225-V 2.5GbE
– 1* Intel® i225-LM 2.5GbE

Graphics

– Intel® UHD Graphics, shared memory
– 1* HDMI (Max Resolution: 1920×1080@60Hz)

Storage

– 1* M.2 M-key (2242/2280, PCIe Gen.4×4 w/SATA interface)
– 1* M.2 M-key (2280, PCIe Gen.4×4 w/SATA interface) support NVMe
– 2* 2.5” SATA HDD device support RAID 0, 1 (support 2.5” HDD with a height≦10mm)

Expansion

– 1* M.2 E-key (2230, USB2.0/PCIe x1) support CNVi
– 1* M.2 B-key (3042, USB3.2 Gen.1/USB2.0/PCIe x1 interface) support 4G Module
– 1* PCIe Gen.4×4 slot

Rear Panel I/O

– AC input CON
– Power on/off SW

Front Panel I/O

– 8* RJ45
– 2* USB3.2 (Gen.2)
– 2* USB3.2 (Gen.1)
– 1* COM (RS232) (Not installed when leaving the factory, the wires are placed in the parts box)
– 1* HDMI (Not installed when leaving the factory, the wires are placed in the parts box)
– 1* Alarm LED, 1* Power LED
– Power on/off SW

Internal Connector

– SIM Card Holder

Power Source

– Power : 1U FLEX 300W POWER
– MB : ATX Power Input (24pin ATX + 4pin 12V)

Compliance

– CE, FCC, LVD, RoHS, ErP Ready

Dimensions

– System: 430 (W) x 252 (D) x 44(H) mm
– Box: 560 (W) x 400 (D) x 380 (H) mm

Temperature

– Operating Temperature: 0 ~ 50° C
– Storage Temperature: -40 ~ 85° C
– Humidity: 10%~95% @40° C (non-condensing)

OS Support

– Windows 11, Linux